Korea Startup Position Sensing System Introduces Health Monitoring System

South Korean radar technology startup bitssensing has launched its new mini healthcare radar mini-H, the smallest high-resolution 60GHz IoT radar sensor in its series. The innovation behind the mini-H showcases the company’s industry-leading expertise in designing and manufacturing cutting-edge radar technologies that can transform healthcare, automotive, mobility, smart home, security, and more.

Korea Startup Position Sensing System Introduces Health Monitoring System

Dr. Jae-Eun Lee, CEO of Bitensing, a seasoned engineer in radar technology and formerly part of Mando Corp.’s Automotive World, knows what it takes to create a safe and convenient connected world. “Revolutionary technologies like mini-H are powering every aspect of our daily lives,” Lee said. “We are committed to integrating these breakthrough radar technologies to help build smart lives and smart cities, ultimately improving Quality of life for all.”

The advanced mini-H sensor is fixed to the wall and can detect the presence, movement, breathing or absence in real time and drop by measuring breathing patterns and pulsating blood vessels without the use of invasive cameras or wearable devices.

Designed for smarter and safer remote medical monitoring systems, the mini-H can be used in dark or wet locations and works regardless of clothing or blankets. Bluetooth and WiFi communication modules allow for seamless transfer of data from the radar to the dashboard or app for easy tracking. This completely wireless product allows for quick and easy software improvements, ensuring the product is always up to date. The product’s sleek, compact aesthetic also makes it easy to integrate, while the plug-and-play style provides instant monitoring of activity with the option to adjust settings for optimal personalization.

As a leading radar solutions company, bitsensing provides a complete end-to-end service, creating customizable radars (such as mini-H) with convenience and safety that exceed industry standards. The flexible bit-sensing architecture enables the team to quickly deliver robust products while working directly with end customers in a wide variety of industries to? ? Ensure satisfaction and broaden their horizons of what is possible in a smart life.

CES attendees can visit bitsensen’s virtual booth from January 11-14, 2021 to learn more about the mini-H. To view the mini-H informational product video, please visit here. If you are interested in learning more about our radar solutions, please visit www.bitsensing.com.

mini-H Product Specifications

Specifications are subject to change without notice. All features, functions, specifications and other product information provided in this document, including but not limited to product benefits, design, price, components, performance, availability and functionality, are subject to change without notice.

*Data driven by respiration detection may be limited and is designed for apnea detection

** Weight without cables

The Links:   NL8060BC26-27 G150XTN06.B

UN: The epidemic caused a sharp drop in exports of auto and mobile phone parts in February this year, and global exports fell by US$50 billion

Global Auto Express According to foreign media reports, the United Nations Conference on Trade and Development (UNCTAD) predicted on Wednesday that China’s exports of various important components such as automobiles and mobile phones will shrink in February this year. If converted on an annual basis, the decline will reach 2%, which means that other countries and industries will lose 50 billion US dollars (about 346.49 billion yuan).

As the world’s second largest economy and the outbreak of the novel coronavirus epidemic, China’s intermediate products account for as much as 20% of global trade, and many countries rely on China for resources and materials required for manufacturing (manufacturing inputs) ).

“There is a knock-on effect in the global economy, which has led to a decline in global exports of US$50 billion (about 346.49 billion yuan),” said Pamela Coker-Hamilton, director of international trade at the United Nations Conference on Trade and Development.

She said: “This value is only the data of February this year, which is a preliminary statistical data, and it may only be a ‘conservative estimate’.”

The data is based in part on a purchasing managers’ index released by Chinese authorities on Saturday, which showed factory activity in China contracting at a record pace, even faster than during the 2008 global economic crisis. Serious, which also shows the severity of the damage caused by this outbreak.

According to the United Nations Conference on Trade and Development, countries or different regions have suffered huge losses due to the interruption of supply caused by the epidemic. , South Korea, Taiwan, and Vietnam lost US$5.8 billion (approximately 40.2 billion), US$5.2 billion (approximately 36 billion), US$3.8 billion (approximately 26.3 billion), and US$2.7 billion (approximately 18.7 billion yuan) and 2.3 billion U.S. dollars (about 15.9 billion yuan).

Sectors such as precision instruments, machinery, automobiles and communications equipment were among the hardest hit, but the report did not cover agriculture and services.

The report pointed out that Honda said that in March this year, the company’s two factories in Saitama County will reduce production for about a week, and the company is worried that China’s supply will be interrupted.

Alessandro Nicita, an economist at the United Nations Conference on Trade and Development, said: “The losses suffered by the EU auto industry this time are as high as 2.5 billion US dollars (about 17.3 billion yuan).”

When asked if the manufacturing industry will diversify its supply chain, Nicita said: “In the short term, no, because it takes time to develop new suppliers. But in the long run, it may. “

He said that China has established a huge logistics transportation network, covering ports, shipping routes and cargo flights.

When talking about the gradual recovery of China’s industrial production, he said: “If factories can gradually resume production, it is hoped that they can make up for the lost production capacity in February. If the production capacity of Chinese factories remains low, the situation in the global supply chain will further deteriorate. “

As the world’s major supplier of generic drugs, India has imposed export restrictions on 26 types of pharmaceutical raw materials and drugs produced in the country, including: paracetamol (paracetamol), a common painkiller often used as Acetaminophen is for sale as the outbreak disrupts supply chains.

Asked whether such restrictions were a sign that the coronavirus had had a “strangulating” effect on global supply chains, Cork-Hamilton said: “In the short term it does, it looks like it does.”

She said: “Assuming that the epidemic cannot improve in the short term, it may have a severe impact on the global economy, leading to a continuous decline in the global economy.” (This article is a compiled work, the original English text and pictures used are selected from Reuters)

The Links:   DMF-50174ZNF-FW CM150MXUD-24T

Power Subsystem for Photoplethysmography (PPG) Remote Patient Vital Signs Monitoring – Part 1

Switch-mode power supplies (also known as SMPS or DC-DC converters) are often used in wearable healthcare applications for reasons including size considerations and energy efficiency. Designers can use these power supplies to create battery-powered products that last longer. Unfortunately, designers still need to select the appropriate SMPS device and then create a proper board layout to protect the performance of the biosensing device in the system.

By Felipe Neira and Marc Smith

Summary

This two-part article presents a proven switch-mode power supply circuit design for remote patient vital sign monitoring applications, including biosensors with excellent system signal-to-noise ratio performance. The first part describes discrete solutions that provide excellent performance, and the second part describes integrated solutions for space-constrained applications.

What you will learn:

• Learn how to select a power configuration based on PPG system requirements.
• Review implementation of switch-mode power supply reference circuits for discrete (Part 1) and integrated design (Part 2).
• Understand power supply performance test methods to validate the system under different device use cases and transient loading conditions.
• Obtain a checklist to verify implementation.
• Gain troubleshooting knowledge to resolve implementation issues.

This two-part article presents a pre-validated power circuit design for photoplethysmography (PPG) remote patient vital sign monitoring applications, including biosensors with excellent system signal-to-noise ratio performance. PPG devices can be used to measure changes in blood volume, from which vital sign information such as blood oxygen levels and heart rate can be obtained. Part 1 describes a discrete power-supply circuit design solution that provides excellent performance using the MAX86171 optical pulse oximeter and heart-rate sensor analog front-end (AFE). The second section describes an integrated solution for space-constrained applications.

Switch-mode power supplies (also known as SMPS or DC-DC converters) are often used in wearable healthcare applications for reasons including size considerations and energy efficiency. Designers can use these power supplies to create battery-powered products that last longer. Unfortunately, designers still need to select the appropriate SMPS device and then create a proper board layout to protect the performance of the biosensing device in the system.

To simplify and speed up the development process, Analog Devices offers pre-validated (i.e., designed, built, and tested) power subsystem circuit designs to guarantee the signal-to-noise ratio (SNR) performance of each biosensing AFE device. This article describes these power supply circuits in detail, with each example accompanied by a verification checklist and troubleshooting guidelines to assist the circuit designer when needed. Figure 1 shows a block diagram of a standard power supply found in many remote patient monitoring applications.

design limit

enter

Output (VDIG, VANA, VLED)

noise, RTO

VIMIN

VIMAX

VOMIN

VOMAX

VPP(max)

3.0V1

4.2V1

1.6V

2.0V

30mVPP

2.0V2

3.4V2

1.6V

2.0V

30mVPP

4.7V

5.3V

20mVPP

Notes:

Secondary battery (LiPo)
Primary battery (lithium button cell)

design configuration

design configuration

battery implementation

Board Area Layout Considerations

separate

One time (button battery)
Quadratic (Li & LiPo)

Implement separate discrete circuits.

integrated

Quadratic (Li & LiPo)

A single integrated circuit is used to minimize board area requirements.

Only secondary batteries are supported.

Discrete Design Description

This DC-DC converter design regulates three output power rails for remote patient vital sign monitoring subsystems. The circuit provides proper line and load regulation while maintaining a low output noise level to maintain biosensing SNR performance, powered by a rechargeable Li-polymer battery or a primary Li-ion battery. Figure 2 shows the PPG subsystem using discrete power devices.

key components

logo

element

describe

U1

DC-DC Converter

Power Conversion Devices (MAX38640A and MAX20343H)

L1

2.2μH Inductor

Low Equivalent Series Resistance (ESR) Inductive (Energy) Storage Element1

C1

22μF capacitor

Low ESR capacitive (energy) storage element1

L1 and C1 are specially selected passive components that are critical to the performance of a DC-DC converter (also known as a switch-mode power supply).

1.8V SMPS circuit using nanoPower buck converter

The following circuit, based on the MAX38640A nanoPower step-down converter (Figure 3), shows typical input and output supply levels for proper operation of an SMPS device in a remote patient vital-signs monitoring application. As shown in Figure 3, the input and output ports can be probed with a digital multimeter (DMM) to verify the supply voltage level. Power supply output levels can vary due to various factors, such as:

The battery is discharged.

Load change (device mode change, device wake-up from sleep mode, etc.).

1.8V SMPS Circuit Verification Checklist

The following circuit verification checklist (Figure 4) is intended to assist designers in performing various electrical reference checks on 1.8V SMPS circuit printed circuit board assemblies. This checklist can also be used as a template for product testing.

The following table can be used as a checklist to verify the operation of an analog or digital 1.8V SMPS circuit using the MAX38640A device connected to a biosensing circuit load.

step

operate

program steps

Measurement

need help?

1

Check input DC power
LP401230 LiPo battery
CR2032 lithium button battery

Measure the voltage across the battery

Reading range:
3.0VC 4.2V
2.0VC 3.4V

Troubleshooting Instructions

2

Check input DC power
Coin Batt
CR2032 lithium button battery

Measure the voltage across CIN

Reading range:
3.0VC 4.2V
2.0VC 3.4

3

Check VOUT DC level

Measure the voltage across COUT

Reading range:
1.71V 1.89V

4

Measure the voltage across the load

Reading range:
1.71V 1.89V

5

Check output noise level

10x single-ended probes or differential active probes using pigtail leads

The ripple noise level should be


MAX38640A (1.8V output) SMPS circuit troubleshooting

The following circuit troubleshooting instructions (Figure 5) can help the designer if there is a problem with the operation of the 1.8V SMPS circuit. This guide addresses the most common issues you may encounter when implementing this type of switch mode power supply.

Troubleshooting the MAX38640A SMPS Circuit:

Step 1C Check the input voltage: Measure the voltage at the input of the MAX38640A device using a digital multimeter (DMM) with an internal impedance of 1MΩ or greater, such as the Fluke 87. Be sure to connect the negative “black” lead to ground and the positive “red” lead to the input “IN” pin of the device. If the input pins are not easily accessible, route the leads through the input capacitor CIN.

Use the following table to diagnose and resolve related issues:

Input voltage reading

potential cause

operate

note

Zero Volts/No Reading

The battery is not charged.
The battery is defective.

Disconnect the battery and check the voltage. If it reads 0V, charge the battery.

If it won’t charge, replace the battery.

No battery connection (IN or GND wire).

With the battery disconnected, test the conductivity from the battery connector to the device input.

The PCB may have an open circuit.

Input capacitor shorted to ground

Disconnect the battery and check the continuity of the capacitor.

Capacitor damage;
There may be a short on the PCB.

The EN pin is grounded.

With the battery disconnected, test the conductivity from the EN pin to ground.

The EN pin needs to be tied high for proper operation.

Reading (LiPo battery)
Reading (Lithium-ion battery)

battery is low
The battery is defective.

Disconnect the battery and check the voltage. If the reading is below 2.8V, recharge the battery.

If it won’t charge, replace the battery.

3.0V ≥ reading ≤ 4.2V
(LiPo battery)
2.0V ≥ reading ≤ 3.4V
(Lithium Ion Battery)

No action.

If the input voltage is normal, go to step 2.

Reading ≥ 4.2V
(LiPo battery)
Reading ≥ 3.4V
(Lithium Ion Battery)

The battery is defective.

Replacement battery.

Step 2C Examine the inductor signal waveform: Use an oscilloscope or digital storage oscilloscope (DSO) to probe the LX pin on the MAX38640A device. If the input pins are not easily accessible, place the probe on the inductor terminal capacitance.

Note: An oscilloscope and probes with a minimum bandwidth of 200MHz are recommended.

If the circuit is running at a light load (i.e. less than 50mA), the waveform should look like Figure 6.

If the circuit is running under a heavy load, the waveform should be a square wave with minimal ringing on the rising and falling edges, as shown in Figure 7.

The square wave amplitude should be approximately equal to the input battery voltage. The square wave bottom voltage should be about 200mV to 300mV below ground (eg -250mV). The duty cycle is directly proportional to the output voltage. Therefore, an input battery voltage of 3.6V will have a duty cycle of approximately 50% when generating an output voltage of 1.8V. Figure 8 shows the relationship between duty cycle and output voltage.

Deviations from an ideal square wave can be used to effectively diagnose and solve many problems.

Use the following table to diagnose and resolve related issues:

input waveform

potential cause

operate

note

Incorrect amplitude

The inductor is open.

IN pin open circuit

EN open circuit or ground

Disconnect the battery and check all connections to the DMM.

Repair the PCB if needed.

Incorrect duty cycle (not related to output voltage)

The value of RSEL is incorrect (768KΩ). The external resistor is damaged.

Disconnect battery, check RSEL with DMM (R measure)

Replace with resistor of correct value.

Leave the RSEL pin open (Vo = 2.5V).

Check the 2.5V output.
With the battery disconnected, test the conductivity from the resistor to the RSEL pin.

The PCB may have an open circuit.

RSEL pin is shorted to ground (Vo=0.8V)

Check the 0.8V output.
Disconnect the battery and measure the resistance across the capacitor.

There may be a short on the PCB.

wave distortion

circular rising edge

Poor inductor connection

Reconnect the inductor. Replace inductor.

Poor connections can result in high line resistance

Step 3A-C Check output DC voltage: Measure the voltage at the output of the MAX38640A device using a DMM with an internal impedance of 1MΩ or greater (such as a Fluke 87). Be sure to connect the negative “black” lead to ground and the positive “red” lead to the output “OUT” pin of the device. If the output pins are not easily accessible, route the leads through the output capacitor COUT.

Use the following table to diagnose and resolve related issues:

Output voltage reading

potential cause

operate

note

Zero Volts/No Reading

No connection from SMPS to COUT

Disconnect the battery and test the conductivity from output to COUT

The PCB may have an open circuit.

The output capacitor is shorted to ground

Disconnect the battery and check the continuity of the capacitor.

There may be a short on the PCB.

low reading

(

Wrong inductance value
Inductor saturation
Wrong RSEL value

Disconnect the battery and check the inductance and/or resistance values.

1.71V ≥ reading ≤ 1.89

No action.

can work.

reading too high

(> 1.89 VDC)

Wrong RSEL value

Disconnect the battery and check the RSEL value.

Step 3B C Check output AC voltage: Using an oscilloscope or DSO, measure the output ripple (AC) by probing the OUT pin on the MAX38640A device. To properly measure the output and minimize RF pickup, a 10x pigtail probe is recommended. Differential active probes can also be used to further reduce ambient noise.

Note: An oscilloscope and probes with a minimum bandwidth of 200MHz are recommended.

If the circuit is working properly, the waveform should be a 1.8VDC output with a small ripple waveform superimposed on it. Figure 9 shows the ripple waveform.

Use the following table to diagnose and resolve related issues:

input waveform

potential cause

operate

note

Ripple amplitude is too high (> 20mVpp)

Wrong capacitor value; capacitor is defective.

Disconnect battery and check all connections to DMM; measure capacitance.

Ripple Frequency vs. VLXSquare wave frequency mismatch

light load

check load

Broadband noise is too high

Excessive load; ambient noise.

Check load and ambient noise.

Use pigtail 10x probes or active differential probes at the output to reduce ambient noise.

Transition spikes too high (> 30mVp)

load inductance;

Insufficient input current.

Check line inductance; check input current with oscilloscope.


5.0V SMPS Circuit Using Low Noise Buck-Boost Converter

The following circuit, based on the MAX20343H low-noise buck-boost converter, shows typical input and output supply levels for proper operation of the SMPS device in a remote patient vital-signs monitoring application. As shown in Figure 10, a DMM can be used to probe the input and output ports to verify supply voltage levels. Power supply output levels can vary due to various factors, such as:

The battery is discharged.
Load change (device mode change, device wake-up from sleep mode, etc.).

5.0V SMPS Circuit Verification Checklist

The following circuit verification checklist (Figure 10) is intended to assist the designer in performing various electrical reference checks for 5.0V SMPS circuit printed circuit board assemblies. This checklist can also be used as a template for product testing.

The following table can be used as a checklist to verify the operation of an analog 5.0V SMPS circuit using the MAX20343H device connected to a biosensing circuit load.

step

operate

program steps

Measurement

need help?

1

Check input DC power
LP401230 LiPo battery
CR2032 lithium button battery

Measure the voltage across the battery

Reading range:
3.0VC 4.2V
2.0VC 3.4

Troubleshooting Instructions

2

Check input DC power
LP401230 LiPo battery
CR2032 lithium button battery

Measure CINvoltage across

Reading range:
3.0VC 4.2V
2.0VC 3.4

3

Check Vout DC level

Measure Coutvoltage across

Reading range:
4.75V 5.25V

4

Check Vout DC level

Measure the voltage across the load

Reading range:
4.75V 5.25V

5

Check output noise level

10x single-ended probes or differential active probes using pigtail leads

The ripple noise level should be


5.0V SMPS Circuit Troubleshooting Guide

The following circuit troubleshooting instructions (Figure 11) can assist the designer if there is a problem with the operation of the 5.0V SMPS circuit. This guide addresses the most common issues you may encounter when implementing this type of switch mode power supply.

Troubleshooting the MAX20343H SMPS Circuit:

Step 1C Check the input voltage: Measure the voltage at the input of the MAX20343H device using a DMM with an internal impedance of 1MΩ or greater (such as a Fluke 87). Be sure to connect the negative “black” lead to ground and the positive “red” lead to the input “IN” pin of the device. If the input pins are not easily accessible, route the leads through the input capacitor CIN.

Use the following table to diagnose and resolve related issues:

Input voltage reading

potential cause

operate

note

Zero Volts/No Reading

The battery is not charged.

The battery is defective.

Disconnect the battery and check the voltage. If it reads 0V, charge the battery.

If it won’t charge, replace the battery.

No battery connection (IN or GND wire)

With the battery disconnected, test the conductivity from the battery connector to the device input.

The PCB may have an open circuit.

Input capacitor shorted to ground

Disconnect the battery and check the continuity of the capacitor.

There may be a short on the PCB.

EN pin (SDA/EN) grounded

With the battery disconnected, test the conductivity from the battery connector to the device input.

The EN pin needs to be tied high for proper operation.

reading

battery is low

battery is defective

Disconnect the battery and check the voltage. If the reading is below 2.8V, recharge the battery.

If it won’t charge, replace the battery.

2.8V ≥ reading ≤ 4.2V

No action.

The input voltage is normal. Continue to step 2.

Reading ≥ 4.2V

battery is defective

Replacement battery.

Step 2C Examine the inductor signal waveform: Use an oscilloscope or DSO to probe the HVLX pin on the MAX20343H device. If the input pins are not easily accessible, place the probe on the inductor terminal capacitance.

Note: An oscilloscope and probes with a minimum bandwidth of 200MHz are recommended.

If the circuit is working properly, the waveform should be pulsed with minimal ringing on the rising and falling edges, as shown in Figure 12.

The 500ns pulse amplitude should be approximately equal to the input battery voltage. The pulse wave bottom voltage should be within 100mV of the ground potential. The output frequency and duty cycle of the pulse wave are proportional to the load current. Figures 13 and 14 show the output waveforms and signal frequencies under different load conditions.

Deviations from an ideal square wave can be used to effectively diagnose and solve many problems.

Use the following table to diagnose and resolve related issues:

input waveform

potential cause

operate

note

Incorrect amplitude

The inductor is open.

IN pin open circuit

EN open circuit or ground

Disconnect the battery and check all connections to the DMM.

Repair the PCB if needed.

Incorrect duty cycle (not related to output voltage)

RSELIncorrect value (6.65KΩ). The external resistor is damaged.

Disconnect battery, check R with DMM (R measurement)SEL

Replace with resistor of correct value.

RSEL pin open circuit (Vo=3.3V)

Check the output of 3.3V
With the battery disconnected, test the conductivity from the resistor to the RSEL pin.

The PCB may have an open circuit.

RSEL pin is shorted to ground (Vo=5.5V)

Check the output of 5.5V
Disconnect the battery and measure the resistance across the capacitor.

There may be a short on the PCB.

wave distortion
circular rising edge

Bad inductor connection.

Reconnect the inductor. Replace inductor.

Poor connections can result in high line resistance

Step 3A-C Check output DC voltage: Measure the voltage at the output of the MAX20343H device using a DMM with an internal impedance of 1MΩ or greater (such as a Fluke 87). Be sure to connect the negative “black” lead to ground and the positive “red” lead to the output “OUT” pin of the device. If the output pins are not easily accessible, route the leads through the output capacitor COUT.

Use the following table to diagnose and resolve related issues:

Output voltage reading

potential cause

operate

note

Zero Volts/No Reading

No connection from SMPS to COUT

Disconnect the battery and test the conductivity from output to COUT

The PCB may have an open circuit.

The output capacitor is shorted to ground

Disconnect the battery and check the continuity of the capacitor.

There may be a short on the PCB.

low reading

(

Wrong inductance value
Inductor saturation
RSELwrong value

Disconnect the battery and check the inductance and/or resistance values.

4.75V ≥ reading ≤ 5.25V

No action.

can work.

reading too high
(> 5.25 VDC)

Wrong RSEL value

Disconnect the battery and check the RSEL value.

Step 3B C Check output AC voltage: Using an oscilloscope or DSO, measure the output ripple (AC) by probing the OUT pin on the MAX20343H device. To properly measure the output and minimize RF pickup, a 10x pigtail probe is recommended. Differential active probes can also be used to further reduce ambient noise.

Note: An oscilloscope and probes with a minimum bandwidth of 200MHz are recommended.

If the circuit is working properly, the waveform should be a 1.8VDC output with a small ripple waveform superimposed on it. Figure 15 shows the ripple waveform.

Use the following table to diagnose and resolve related issues:

input waveform

potential cause

operate

note

Ripple amplitude is too high

Wrong capacitor value; defective capacitor

Disconnect battery and check all connections to DMM; measure capacitance

Ripple Frequency vs. VHVLXPulse wave frequency mismatch

light load

check load

Broadband noise is too high

Excessive load; ambient noise.

Check load and ambient noise.

Use pigtail 10x probes or active differential probes at the output to reduce ambient noise.

jump spike too high

load inductance;

Insufficient input current

Check line inductance; check input current with oscilloscope.


epilogue

This article is divided into two parts. The above is the first part, which describes the pre-validated discrete power supply circuit for use with the MAX86171-based PPG remote vital signs monitor. These power circuits can also be used with MAX86141-based PPG devices.

The second part of this article describes a pre-verified integrated power supply circuit for use with MAX86171-based and MAX86141-based PPG remote vital-signs monitors.

For appropriate verification test data for discrete and integrated power supply implementations, visit the Maxim Integrated (now part of Analog Devices) website:

“Power Subsystems for Remote Patient Vital Signs Monitors”.

illustrate:

Figure 1. Block Diagram of a Typical PPG Remote Patient Vital Signs Monitor
Figure 2. Block Diagram of PPG Subsystem Using Discrete Power Devices
Figure 3. 1.8VDC MAX38640A SMPS Circuit for Remote Patient Vital Signs Monitoring Applications
Figure 4.1.1 Verification checklist for 8VDC MAX38640A SMPS circuit design
Figure 5. Troubleshooting tools for the MAX38640A SMPS circuit
Figure 6. Oscilloscope screenshot of typical MAX38640A VLX waveform at light load
Figure 7. Oscilloscope screenshot of switching waveforms for the MAX38640A
Figure 8. MAX38640A Duty Cycle vs. Output Voltage Plot
Figure 9. Oscilloscope screenshot of MAX38640A output ripple waveform
Figure 10. Block Diagram of the 5.0VDC MAX20343H SMPS Circuit for Remote Patient Vital Signs Monitoring Applications
Figure 11. Troubleshooting tools for the MAX20343H circuit
Figure 12. Oscilloscope screenshot of a typical MAX20343H HVLX waveform at a light load of 10mA
Figure 13. Oscilloscope screenshot of typical MAX20343H HVLX waveform at 125mA load
Figure 14. Oscilloscope screenshot of typical MAX20343H HVLX waveform at 246mA load
Figure 15. Oscilloscope screenshot of MAX20343H (5V) output ripple waveform

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is the world’s leading semiconductor company dedicated to bridging the physical and digital worlds to enable breakthrough innovations at the intelligent edge. ADI provides solutions combining analog, digital and software technologies to promote the continuous development of digital factories, automobiles and digital medical care, address the challenges of climate change, and establish a reliable interconnection between people and everything in the world. ADI’s fiscal year 2022 revenue exceeds US$12 billion, with more than 24,000 employees worldwide. Together with 125,000 customers around the world, ADI helps innovators continue to exceed what is possible. For more information, visit www.analog.com/cn.

about the author

Felipe Neira

Senior Member of the Applied Technology Team – Training and Technical Services
Maxim Integrated (now part of Analog Devices)
www.maximintegrated.com

About the author: Felipe Neira is an applications engineer at Maxim Integrated (now part of Analog Devices). He enjoys working on portable and wearable solutions with a focus on battery power management for health sensors. In addition, he provides technical support for all of ADI’s broad market products. Felipe joined the company shortly after graduating from the University of California, Santa Cruz with a Bachelor of Science in Electrical Engineering (BSEE).

Marc Smith

Key members of the application technology team
Maxim Integrated (now part of Analog Devices)
www.maximintegrated.com

About the author: Marc Smith is a member of the Health and Medical Biosensing Applications Technology Team at Maxim Integrated (now part of Analog Devices). He is an industry expert in MEMS and sensor technology with over 30 years of experience in sensor product and electronics development for multiple markets. Marc holds 12 patents and has authored more than ten publications. He earned a Bachelor of Science in Electrical Engineering (BSEE) from the University of California, Berkeley and a Master of Business Administration (MBA) from Saint Mary’s College of California.

The Links:   NL8060BC31-17 6MBI100S-120-02

Minimize yield impact by avoiding overspeed and underspeed tests

【Introduction】In nanotechnology for automotive SoCs, most defects on silicon are due to timing problems. Therefore, full-speed coverage requirements in automotive design are very stringent. In order to meet these requirements, engineers put a lot of effort into obtaining higher real-speed coverage. The main challenge is to obtain silicon of the required quality in high yields at the lowest possible cost. In this article, we discuss issues related to overtesting and undertesting in real-time test that can lead to yield problems. We will provide some suggestions to help overcome these problems.

In nanotechnology for automotive SoCs, most defects on silicon are due to timing issues. Therefore, full-speed coverage requirements in automotive design are very stringent. In order to meet these requirements, engineers put a lot of effort into obtaining higher real-speed coverage. The main challenge is to obtain silicon of the required quality in high yields at the lowest possible cost. In this article, we discuss issues related to overtesting and undertesting in real-time test that can lead to yield problems. We will provide some suggestions to help overcome these problems.

The main purpose of at-speed testing is to detect any timing failures that may occur in the silicon at its operating frequency. The important part to test is the logic that generates controllable clock pulses at the same frequency as required for functional operation. A method of providing controlled clock pulses is via an input pad slave tester (ATE), as this reduces complexity and minimizes the need for additional test logic to be built into the design.

However, this approach has frequency limitations because pads typically cannot support very high frequency clocks. Therefore, an on-chip phase-locked loop (PLL) and oscillator are used to provide the clock pulses. However, the free-running clocks of these cannot be used directly, because first we have to shift the vector through the scan chain at a low frequency (shift frequency), capture at the functional frequency, and then clear the data at the shift frequency. We need controllable pulses while capturing at the functional frequency, which can be achieved by using chopping logic. Figure 1 shows a typical clock architecture with full-speed clocks.


FIGURE 1: TYPICAL CLOCKING ARCHITECTURE WITH FULL SPEED CLOCKS

For any SoC, STA (Static Timing Analysis) signoff is integral to verifying timing performance. Timing signoff ensures that the silicon will run at the desired functional frequency. The same logic applies to full speed testing. STA signoff must be done for both full-speed and functional modes because the clock paths may be different in full-speed mode and the added test control logic also needs to be timed. The chopping logic is not required in normal functional mode, so we also need to meet the timing requirements for the chopping logic.

Ideally, it shouldn’t be a problem to turn off timing in full speed mode if the changes to the clocks are done in a common path, eg at the beginning of the clock path, so that the changes to the start and capture flip-flops are common and thus don’t Affects the setup and hold timing of the design. Test control logic generally works at low frequency or static, so it is not difficult to meet timing requirements.

Typical SoC Clocking Scheme

However, modern SoC design is not that simple. High performance and low leakage requirements lead to designs with various clock sources such as PLLs, oscillators, clock dividers, etc. in a single SoC. Depending on the architecture, there may be many IO interfaces running on an external clock of several MHz, such as SPI, JTAG, I2C, etc. Therefore, different parts of the SoC can run at different frequencies.

This is where things get complicated. The previously discussed clocking solution (chopping logic) for full-speed clocks is not sufficient for complex chips running at different frequencies. In full speed testing, these complexities lead to problems known as undertesting and overtesting, which lead to the need for testing.

Overtesting occurs when logic is tested at a higher frequency in full speed mode than it is running in functional mode. Referring to Figure 2, if pll_clock is provided to any low frequency modules like watchdog and RTC in full speed mode, overtesting will occur. A key reason for this approach is the simplicity of the test clock path, since this approach requires only changes to the functional logic. In our example we just need to bypass all divided clocks/RC osc clocks/external clocks by scan clock which in turn will be controlled by pll clock.

Figure 2: Memory and Flash run on the divided PLL clock, while the platform works on the actual pll_clock. The internal RC oscillator clocks blocks such as the RTC (Real Time Counter) and Watchdog Timer, which require very slow clock frequencies. Building blocks like the Display Master have both an IPS port and a camera port. The IPS interface typically operates at the system frequency, while the camera logic operates at an externally provided slower frequency clock. IO interfaces such as SPI and JTAG operate at a few MHz. Therefore, the overall configuration of the SOC requires multiple blocks operating at multiple frequencies.



Undertesting occurs when any logic is tested in full speed mode at a frequency lower than the expected operating frequency. This situation usually exists when it is not possible to provide a test clock at the same frequency as the functional mode, but at the same time it is not possible to shut down the design at a high frequency due to large data path delays or technical limitations. In this case, we are forced to provide a lower frequency clock.

Therefore, it is necessary to test the silicon for defects at exactly the same frequency as the functional frequency. Any deviation can lead to over-testing or under-testing problems:

• When the functional logic is designed to operate at a lower frequency, shutting down the higher frequency design for full speed testing will impact overall design area and power. In the case of timing critical designs, real-time test tools will use high drive strength cells and may even require low Vt cells to meet these frequency targets.

• Even if the design’s timing closes at a higher frequency, at the expense of power and area, we can be unnecessarily pessimistic in our yield calculations. Unrealistic yield drops can occur during at-speed testing. For example, in a design with two clock domains (domain1 @ 120MHz and domain2 @ 80MHz), we closed the timing of the entire design at 120MHz flat to simplify the clocking architecture in full speed mode. All ATPG pattern generation for both domains will occur at 120MHz. Due to process variability, on silicon, domain1 works fine at 120MHz, but domain2 only works at 110MHz, so all dies will be considered defective parts. Although the chip is functional enough, based on the failure of the full speed mode, we will declare the chip as a failed chip, which will reduce our yield.

• In the case of insufficient testing, the full speed mode cannot guarantee that the chip will actually work at the expected frequency. Since bad chips can pass the full-speed test, the purpose of the original full-speed test to filter out bad chips is defeated. In this case, we would be overly optimistic in our yield calculation.

With the shortcomings in mind, we will focus on the reasons for overtesting and undertesting in any SoC:

Simplicity of Clock Architecture

Given that there are so many clock sources in functional mode, it is easy to provide a small number of controllable test clocks in full speed mode.


Figure 3: A simple and simple test clock solution is to multiplex the PLL clock with an external clock, even for full-speed mode, which is a case of overtesting.

Let’s take the DSPI Module as an example. The IP operates on 2 clocks, a 15 MHz external clock and a 120MHz functional PLL clock for the internal logic. As shown in Figure 3, the simple and easy test clock solution is to multiplex the PLL clock with an external clock, even for full-speed mode, which is a case of overtesting.

Dividers in Nanodesign

For the clock divider, the original source clock is used for all test modes and multiplexed with the divided clock, as shown in Figure 4 below.


FIGURE 4: The original source clock is used for all test modes and multiplexed with the divided clock.

This is a common scenario in designs where we have many crossovers but we cannot use them in full speed testing because these crossovers are not controllable (phase determined) during the test. Therefore, an easy way to simplify testing at full speed is to provide an undivided clock in test mode, which leads to overtesting.

Timing exceptions such as multicycle paths

Various timing exceptions in the form of multicycle paths, false paths, profiling, etc. are used in designs when signal propagation requires more than a single-cycle clock during functional operation. These exceptions are valid in at-speed mode, so should also be properly migrated to full-speed mode in the form of SDC (Standard Design Constraints Document). However, current ATPG tools have limitations in understanding some of these constraints, especially multicycle paths. When parsing through an SDC file, it ignores multicycle paths and does not create any schema for them. For example, if we have a multicycle of 2 from one register to another, it will simply mask any patterns that check for captures between those two registers.

So this means that all multi-cycle paths are not tested at full speed, resulting in undertesting. On the other hand, if these exceptions are not part of the SDC file, the timing checks will happen in a single clock cycle, while functionally the path will work in two clock cycles, which is a typical case of overtesting. In general, this is a big problem, because usually we have many multi-cycle exceptions in any complex design, which can lead to over-testing or under-testing if we take the traditional approach.

real-time test

So far we’ve seen that neither overtesting nor undertesting is desirable, so we need a way to ensure that the real benefits of real-time testing are realized without compromising the QOR of the design. The idea is that there shouldn’t be any significant area/power overhead on the design due to real-time testing, but at the same time we should make sure that the real-time test design is checked at the expected functional frequency, not above or below that frequency.

Here is a list of some guidelines/techniques to ensure full speed testing is done the right way:

• Identify different frequency domains in your design in func mode. This is an important step because the sooner you determine the frequency domain, the better you can understand at-speed test requirements. A thorough analysis of the clocking architecture helps to define a defined full-speed clock. For example, when starting a project, there is usually not much emphasis on frequency targets for external IO interfaces, which can later affect defining a full-speed clocking strategy for these interfaces.

• Definition of full-speed mode timing constraints and generation of functional mode constraints. Any timing critical paths in full speed mode can be addressed at the beginning of the design cycle. It’s always easier to make changes at an early stage.

• One of the key solutions is to identify under-testing and over-testing situations, as many times these issues pop up during the final STA run and are not even noticed when timing is met. Using some kind of script, it is possible to compare the frequency of all registers in functional mode and full speed mode. Divide the registers into three categories: Flip-flops with the same frequency in both modes – can be used; Flip-flops in full-speed mode have a lower frequency than in functional mode – the case in the test; Flip-flops in full-speed mode Higher frequencies than in functional mode – a case of overtesting.

Once these cases are identified, a thorough analysis should be performed and all architectural possibilities explored to provide a clock at the exact same frequency as in functional mode.

To resolve timing anomalies, the solution is to convert multi-cycle paths to single-cycle paths by testing at a lower frequency. The concept is simple. Consider a design operating at 200MHz with several 2 multicycle paths. Timing these paths at 200MHz with a multicycle of 2 is equivalent to testing the paths at 100MHz in a single cycle. In full speed testing, the logic is tested in two passes. In a pass, a capture clock of 200MHz will be provided to test all single-cycle paths and all multi-cycle paths will be masked. In the second pass, a capture clock of 100MHz is provided to test all multicycle paths only. The same concept can be applied to higher multicycles.

Performing at-speed testing multiple times will also solve the problem of over-testing/under-testing to a large extent. As we discussed above, it is sometimes not possible to clock all domains at the same frequency, but we can do this by capturing clocks at multiple frequency configurations per pass. Usually, in our design where pll is used as system clock, we have the flexibility to configure pll to some discrete frequency.

Overtesting issues associated with crossovers can be resolved using the same multiple testing approach. The difference is that in case of multicycle paths flip-flops can be masked but in case of dividers we need controllability of the divided clock so that the clock can be gated in scan mode.





Figure 5: When the system clock is 200Mhz, during the at-speed test on channel 1, the clock gating logic will gate the clock to the domain that normally operates at 100Mhz (by dividing by 2 logic).

As shown in Figure 5, during the first run at full speed with the system clock at 200Mhz, the clock gating logic will gate the clock to the domain that normally runs at 100Mhz (by dividing by 2 logic). But in round 2, when the system clock is set to 100Mhz, the enable of the clock gating cell will be driven to logic 1. This will ensure that the logic is now tested at the expected frequency of 100Mhz.

Using the guidelines above, it should be possible to resolve most issues related to over- and under-testing. But in case forced to choose between undertesting and overtesting, the decision depends on the application of the SoC. In automotive design, where personal safety is the primary consideration, safe over-testing methods should be chosen, while in power-hungry designs, such as in networking and wireless, testing is required. Even for these cases, every effort should be made to ensure that the deviation from the desired frequency is as small as possible.

Let’s take an example of a design with multiple frequency clocks that will help understand the concept:

Assuming a design operating at 240MHz, we have a multicycle of 2, 3, 4, etc. for the various paths. There are also interfaces that operate on external clocks of 10MHz and 60MHz. To avoid any kind of over-testing or under-testing, run the test multiple times in full speed mode. Configure the PLL at 240, 120, 80, 60MHz and test all logic at actual functional speed.

• 1st pass: @240MHz – all single cycle paths (masked 100MHz and 60MHz interfaces, rest of SDC is normal)
• 2nd pass: @120MHz – path for multicycle 2 (removes multicycle 2 exception from SDC) + 100MHz interface logic (overtested)
• 3rd pass: @80MHz – path with multicycle 3 (removes all multicycle anomalies from 2 and 3)
• 4th pass: @60MHz – 4 paths + multicycle paths for 60mhz interface logic (remove all multicycle anomalies)

in conclusion

As SoC functionality becomes more complex and technology moves to lower nodes, good yield is proving to be an important concern for any design house. Yields directly impact the profit and loss equation, and serious effort is needed to address the causes of low yields. At-speed testing is an important measure of silicon quality, so we should aim for high coverage. But at the same time, we should only run our real-speed mode at the proper clock frequency, because testing at the wrong clock frequency can cause problems with overtesting or undertesting. These two situations (undertesting and overtesting) are not conducive to design QOR, nor to yield estimation.

Test clocks should be as important as functional clocks, and efforts should be made to provide clocks of the same frequency to different domains as they are clocked in functional domains. At the same time, considerable attention should be paid to multicycle paths, since they often form an important part of the timing paths in any design. At-speed testing in multiple pass is a method to solve multi-cycle path at-speed testing. The Multipass testing approach can also be used to address other over-testing and under-testing situations. So, in conclusion, using the above suggestions and methods, we can achieve more accurate full-rate coverage, which in turn will ensure that we minimize yield degradation issues without compromising the QOR of the design.

The Links:   G104SN03 V1 NL6448BC33-74

5 universities that have stopped enrolling at present: Why did Bei Shizhu stop?

As we all know, one of the “highlights” of my country’s higher education in 2020 is the transfer of independent colleges. Among them, in addition to the independent colleges that can be successfully converted into new schools, there are still some schools that can only stop enrollment and stop running schools. So, what are the independent colleges that have stopped enrolling at the moment? Why did Bei Shizhu stop running the school?

1. List of independent colleges that have stopped enrolling students


In 2020, the Ministry of Education requires all independent colleges in the country to speed up the transfer process. Many of them have been converted into private or public colleges, but there are also a few colleges and universities that can only stop running schools for various reasons. There are at least five such independent colleges:

1. Beijing Normal University Zhuhai Branch


Location: Zhuhai, Guangdong

At present, Beijing Normal University Zhuhai Campus and Beijing Normal University Zhuhai Campus co-exist in one school. From 2019, the school began to gradually reduce the enrollment plan,Enrollment will stop in 2021, and the school will be terminated in July 2024and all merged into the Zhuhai Campus of Beijing Normal University.

2. Business School of Hebei University


Location: Baoding, Hebei

On January 26, 2021, the Ministry of Education issued the “Letter of the Ministry of Education on Approving the Business School of Hebei University to realize the transfer by terminating the school-running method”, announcing that it agreed to the business school of Hebei UniversityAdmissions will be suspended from 2020and realize the transfer by terminating running schools and gradually returning to running colleges and universities.

3. Jinling College of Nanjing University


Location: Nanjing, Jiangsu

Currently, the Suzhou campus of Nanjing University is under construction. On July 22, 2020, Jinling College of Nanjing University issued a letter to all alumni, indicating that the school willFrom September 2020, general undergraduate enrollment will be stopped, and it will be fully integrated into Nanjing University Suzhou Campus in 2022. At the same time, Jinling College alumni will receive the “Nanjing University Alumni Card” issued by the Alumni Association.

4. Hanlin College of Nanjing University of Traditional Chinese Medicine


Location: Taizhou, Jiangsu

Nanjing University of Traditional Chinese Medicine Hanlin College2020 Fall Enrollment Closed, while the Taizhou campus of Nanjing University of Traditional Chinese Medicine began to recruit students at the same time. In addition, the former campus will be set up as the Taizhou campus of Nanjing University of Traditional Chinese Medicine, and after the students complete their studies, Nanjing University of Traditional Chinese Medicine will take back the right to run the school and be responsible for the disposal of the South Hanlin College of Traditional Chinese Medicine.

5. School of Science and Technology, Xinjiang Agricultural University

Location: Urumqi, Xinjiang

On October 25, 2020, the School of Science and Technology of Xinjiang Agricultural University was terminatedmerged into the parent university – Xinjiang Agricultural University.

For these schools, candidates and parents should note:

1) Schools that have stopped enrolling students can no longer apply for the exam;

2) Although these independent colleges have to stop running schools, they are also gradually returning to the headquarters (hosting colleges and universities).

2. Why did Bei Shizhu stop running the school?


Beijing Normal University Zhuhai Branch is one of the few independent colleges with a public nature in China. It is managed by the Guangdong Provincial Department of Education, Beijing Normal University and the Zhuhai Municipal Government. Since the establishment of the school in 2001, the school’s strength has been continuously improved, and it has accumulated a certain popularity in the local area and has won many praises from the outside world. Therefore, when the school announced that it would terminate the school, students, parents and teachers did not understand it, and the controversy continued.

However, there are two important reasons why Beijing Normal University Zhuhai Branch has to stop running schools:

1. Land is required for the establishment of the Zhuhai Campus of Beijing Normal University

Beijing Normal University is a well-known 985 university in my country, and it is also the number one normal university in China. Under the current wave of 985 colleges and universities opening campuses in different places (such as the success of Harbin Institute of Technology), Zhuhai City and Guangdong Province hope to welcome another famous school locally to promote the development of local education. Therefore, the establishment of the Zhuhai campus of Beijing Normal University can be described as the general trend. However, the establishment of a school is inseparable from land, and Beijing Normal University Zhuhai Branch has land, school buildings and other resources. At the same time, the construction of the Zhuhai campus of Beijing Normal University will also use the land used for the Beijing Normal University-Hong Kong Baptist University Joint International College which has been reclaimed by agreement.

2. The Ministry of Education continues to promote the process of transferring independent colleges

Since 2020, there has been continuous news of the establishment of independent colleges in my country. In May, the Ministry of Education directly issued the “Implementation Plan on Accelerating the Transfer of Independent Colleges”, which brought a “great acceleration” to the transfer of independent colleges across the country. For a time, independent colleges across the country began to transfer, mainly to private and public colleges, and if the transfer could not be completed, the school could only be terminated.

In a word, even though Beijing Normal University Zhuhai Branch is a good independent college, its fees are always higher, and its educational strength cannot be compared with that of 985 colleges. Therefore, the termination of the school and the integration of Beijing Normal University into Zhuhai Campus of Beijing Normal University is of positive significance for the higher education of Zhuhai City and even the entire Guangdong Province.

The Links:   LQ9D011 LTM170E4-L01

Remaining true to its original aspiration, Siemens adheres to the road of digital innovation

Recently, Siemens Digital Industries Group held a media communication meeting in Beijing. Leaders and media teachers reviewed Siemens Digital Industries Group’s “highlight moments” in 2020 and introduced the company’s business plan for 2021.

In 2020, the severe impact of the “black swan” of the new crown epidemic on global economic development is obvious to all, and the industry/manufacturing industry, as an important support for my country’s national economy, has also undergone severe tests. Unexpected problems such as workers being unable to arrive at work, market depression, and changing user needs have become the “last straw” that crushed traditional factories with the outbreak of the epidemic, and made them truly realize the importance of digital transformation. We can see that those companies that have achieved certain results in digital transformation can have sufficient resilience and flexibility in the face of sudden risks and uncertainties, and adjust their business in a timely manner with the help of artificial intelligence, industrial Internet and other technologies.

Recently, the Ministry of Industry and Information Technology issued the “Notice on Printing and Distributing the “Industrial Internet Innovation and Development Action Plan (2021-2023)” to deploy in infrastructure, integrated applications, technological innovation, industrial ecology, security and other aspects. The action plan is under the guidance of the “Guiding Opinions of the State Council on Deepening the “Internet + Advanced Manufacturing Industry” to Develop the Industrial Internet”, and is closely linked with the “Industrial Internet Development Action Plan (2018-2020)” released in 2018. The coordinated promotion of more than 10 ministries and commissions shows the country’s determination to implement the industrial Internet, a major industrial strategy.

Today, my country’s industrial Internet has entered a period of rapid development, and the technology and system systems have become mature, and the industry has successfully landed. Against this background, Siemens Digital Industries Group recently held a media communication meeting in Beijing. Leaders and media teachers reviewed Siemens Digital Industries Group’s “highlight moments” in 2020 and introduced the company’s 2021 business planning.

The Chinese market is booming

Wang Haibin, Executive Vice President of Siemens (China) Co., Ltd. and General Manager of Siemens Greater China Digital Industry Group, said, “In fiscal year 2020, despite the impact of the new crown epidemic, Siemens’ business in the Chinese market still achieved positive growth. At the same time, Siemens China Digital Industries Group achieved double-digit growth in the fourth quarter, which is a strong driver of Siemens’ global business.”

Siemens Digital Industries Group focuses on industrial manufacturing. Its business covers a wide range of product lines in process industry, discrete industry and hybrid industry. It helps customers realize the transformation from automation and standardization to digitalization and intelligence, and uses digital twin technology to build product design and product design. The “digital twin” of the three links of manufacturing and product performance drives production line optimization and product iteration by comparing the data differences between design parameters and actual products.

Based on long-term attention and in-depth research on the Chinese market, Wang Haibin proposed that in the future, Siemens’ digital industrial business will have three major driving forces:

Market-driven: The state has increased investment in the construction of new infrastructure such as 5G, edge computing, cloud computing, and industrial Internet, creating a favorable market environment for the development of the digital industry.

Driven by “internal circulation”: China still has a lot of room for development in inland and western regions. Many customers are migrating from coastal areas to the central and western regions, and the demand for digital transformation is increasing.

Driven by consumer demand: Consumers’ increasing demand for personalized and customized products has stimulated the demand for agile development and flexible production in the industrial manufacturing field, which in turn drives the development of the digital industry.

Over the years, Siemens has actively promoted the application of intelligent manufacturing in the domestic market, provided technical support for the implementation of Industry 4.0, and worked with solution providers and traditional electrical engineering companies to provide users with comprehensive solutions combining OT and IT. In addition, under the guidance of policies, Siemens has gathered scientific research think tanks and manufacturing enterprises to jointly build an ecosystem and jointly promote the digital transformation of China’s industries.

Finally, Wang Haibin shared the new vision of Siemens Digital Industries Group with the media teachers present: “‘We create sustainable industrial innovation for a world we want to live in, today and tomorrow’, we can understand it as everyone wants to live In a better world, this better world needs key innovation support from the industry. Among them, ‘continuous industrial innovation’ is precisely the mission of Siemens Digital Industries Group.”

Build an ecosystem together and create the future of automation

Under the guidance of the Chinese government’s “new infrastructure” policy, the Factory Automation Division has also actively participated in the development of this field. For example, we provide complete solutions for vast data centers, 5G modules, subways and tunnels. In addition, we are also committed to helping Chinese enterprises to carry out digital transformation, especially the construction of digital factories. And it has provided leading end-to-end solutions for the metallurgical industry, the automotive industry, the semiconductor industry, and electric vehicle batteries for a long time, helping all walks of life to build digital factories.

Joerg Westerholt, Vice President of Siemens (China) Co., Ltd. Digital Industry Group and General Manager of Factory Automation Division, proposed that looking forward to the future, the automation market is divided into three categories: automation solutions for simple applications, suitable for all applications and Totally integrated automation and digital solutions for the industry, as well as the automation of the future.

in:

For the automation market of simple applications, the Factory Automation Division can meet the needs of customers in the broad market and provide a complete set of cost-effective solutions, such as SMART PLC, SMART IPC, SMART HMI (economical PLC, economical industrial computer, economical human-machine interface) ). In this area, customers are very price-sensitive and Siemens is very competitive.

In the standard automation or high-end automation market, function and efficiency are the core content. Siemens has a comprehensive SIMATIC product portfolio and ensures efficient performance, providing different products and solutions for the entire industry. The safety PLC of Siemens can guarantee the daily safe production of workers, and the redundant PLC can ensure the machine runs with high reliability 24 hours a day.

Siemens continues to explore the “automation of the future” and is committed to being “a major contributor to this trend”. In the future, the Factory Automation Division of Siemens Digital Industries Group will build an ecosystem based on edge computing, organically combine OT and IT, and leverage its AI capabilities to assist customers in developing AI applications suitable for enterprise business, helping customers improve productivity and product quality , to achieve more flexible and safe efficient production.

Wei Yuege introduced in a subsequent interview that Siemens can develop highly customized, business-oriented APPs together with customers, customers provide processes, and Siemens provides automation knowledge. Siemens has established a related team for this purpose. The main business is to assist customers to jointly develop industrial edge APPs. On the basis of APPs, richer business models can be expanded to build a long-term ecosystem.

More blossoms to fully assist the digital transformation of enterprises

Yao Jun, Vice President of Siemens (China) Co., Ltd. Digital Industry Group and General Manager of Process Automation Division, introduced to the participating media how Siemens has helped factories in chemical, sewage treatment, pharmaceutical and other fields increase efficiency and quality during the epidemic:

Water industry: The Web-based control system SIMATIC PCS neo can realize remote debugging and deployment, which solves the problem that technicians cannot be present during the epidemic. In addition, Siemens also launched the DPS digital pumping station, adding functions such as diagnostic prediction and maintenance.

Sewage treatment: Toxic gases released from underground sewage can easily cause harm to inspectors. Siemens uses RTLS technology to monitor the positioning of inspectors in real time. If they stay for a long time, there is a danger of early warning, and the accuracy can reach 10cm.

Pharmaceutical field: Siemens helps companies such as Sinopharm Rongsheng, Shandong Ruiying, and Beishengyan to establish digital production lines.

Petrochemical industry: Siemens helped Sinopec Qingdao Refinery & Chemical Co., Ltd. successfully deploy the SiePA predictive maintenance system to help customers improve operation and maintenance efficiency; realize real-time optimization of process models through digital twins.

Industrial communication and identification solutions: As an indispensable and important part of digitalization, it is not only used in the process industry, but also in discrete industries such as logistics to provide customers with complete communication solutions from OT to IT, including wired, wireless, AGV and other technologies .

In the future, Siemens will increase investment in the chemical industry, and use digital means to help fine chemical, biochemical and other sub-sectors achieve cost reduction and efficiency improvement.

Native digitization helps factories rapidly increase production capacity

Li Lei, general manager of Siemens CNC (Nanjing) Co., Ltd., said: In fiscal year 2020, in the face of the improvement of national living standards and changes in product demand, the Siemens Motion Control Division adjusted its strategy in a timely manner. Through intensive cultivation in the material manufacturing, textile and other industries, it has achieved strong positive sales growth. In the future, Siemens will cooperate with partners and experts in various industries to promote combined products in aerospace, automobile manufacturing and other fields.

Li Lei also introduced the new Siemens Nanjing factory, which is about to be completed and put into production, to the participating media, which is the first native digital factory of Siemens. The so-called “native digitization” refers to the establishment of a simulation model from the first day of the project. The entire process from demand analysis to conceptual design, Module design, detailed design, construction, and operation management of the plant is entirely based on digital twin technology. In this process, the general data platform can call all data for simulation, simulation, practice and adjustment, so as to realize real-time monitoring and agile feedback in the operation process.

For example, in the factory planning and design stage, based on the modeling and simulation functions of Siemens digital industrial software, the simulation model of each design stage is established, and then based on the output rate, equipment utilization rate, personnel work efficiency, yield rate, energy utilization rate, Indexes such as material flow efficiency, personnel walking distance, and in-process inventory are used to find the optimal solution in the model verification.

According to Li Lei, Siemens’ native digital factory will increase production capacity by nearly 2 times, shorten the time to market by 20%, increase the efficiency of personnel utilization by 20%, and increase the utilization rate of factory space by 40%.

Keep up with the demand and work with customers to innovate together

Wang Biao, Vice President of Siemens (China) Co., Ltd. Digital Industry Group and General Manager of Customer Service Division, said, “Whether it is before or after the epidemic, the mission of Siemens Industrial Services has not changed, that is, to closely focus on customer needs and work with customers. Innovate and provide customers with digital services in four aspects: equipment, assets, people, and processes.”

During the epidemic, engineers were unable to arrive at the site in time, so Siemens developed a remote service “Smart Card”, which allows engineers to solve on-site problems remotely in the background, and provides customers with many virtual products including training through the e-commerce platform.

After the resumption of work, Siemens helped customers in the catering industry deploy an intelligent food delivery system to reduce labor and ensure safety after resumption of production; help customers in the automotive, steel and other industries to complete predictive analysis, manage factory production information, and achieve “more, faster, better savings”. “The goal.

In the future, Siemens will replicate and promote the experience accumulated in the process of digital transformation of global factories through the “CIO” model (ie C-consultation, I-implementation, O-operation optimization), and continue to work with partners to develop the industry Digital service, embrace the digital future!

Create a closed loop to enhance the core competitiveness of software

Liang Naiming, global senior vice president of Siemens Digital Industry Software and managing director of Greater China, shared the achievements of Siemens’ industrial digital software business in 2020 and the outlook for 2021 with the participating media online. He introduced, “Software is something that cannot be seen or touched. It is not the same as hardware, but in fact, the software strength of many enterprises is the core competitiveness.”

The latest Xcelerator launched by Siemens includes the entire process from product design, production planning to product manufacturing, production execution, and optimization iterations, creating a closed loop of product application, factory ergonomics and production safety, and integrating all data with multidisciplinary physical operations.” Tie” in the whole life cycle of the product, and iterate and innovate the product continuously within this closed loop.

Liang Naiming said: “Siemens is an industrial software company that can provide end-to-end products and solutions. Through software, the complete manufacturing cycle of product manufacturing, production planning, production execution, and safety production is covered by Xcelerator. At present, Siemens is a leading As an industrial software provider, we can assist in integrating different products of different manufacturers to achieve coordinated operation, so that customers can focus on their own industrial research and development and product manufacturing, and provide customers with the greatest value.”

At the end of the exchange meeting, Wang Haibin, Executive Vice President of Siemens (China) Co., Ltd. and General Manager of Siemens Digital Industries Group in Greater China, when answering questions from reporters, took the upgrade of an elephant into a “perfect elephant” as an example, explaining the era of Industry 4.0. Every link of production and manufacturing should be upgraded to future technologies under the blessing of digitalization, so as to realize the interconnection of data, create a better computer-aided intelligent manufacturing model, and then form a higher level of intelligence, and upgrade the factory to ” The perfect factory”. In the future, Siemens Digital Industries Group will continue to focus on factory automation, digitalization and intelligent industries, and help China’s manufacturing industry complete the upgrade of the “perfect elephant”!

The Links:   T70HFL20S02 2DI150-050 IDELECTRONIC

Viewpoint | Strengthen data security management and promote bank data assets to create value

Challenges and Opportunities for Implementing Regulations such as the Data Security Law

1. Provisions of the “Data Security Law” on the data security protection of commercial banks

For commercial banks, the “Data Security Law” and other regulations are based on the actual data security work, focus on prominent issues in the field of data security, and establish basic data classification and classification management, data asset management and control, data security risk assessment, monitoring and early warning, and security review. requirements, clarifying the data security protection obligations of relevant subjects. The implementation of the “Data Security Law” requires commercial banks to collect data in a legal and proper way, use data reasonably in accordance with the law, ensure the establishment and improvement of a full-process data security management system when carrying out data processing activities, and take corresponding technical measures to ensure data security. For the processing of important data, it is necessary to clarify the person in charge of data security and the management organization, and to implement the responsibility for data security protection. The “Data Security Law” establishes a data classification and classification protection system and defines the scope of important data, which will further stimulate commercial banks to take the initiative to carry out data asset inventory in compliance with regulations, establish a full-process data security management system, and give full play to the power of the value of data elements.

2. Challenges to commercial banks by implementing the Data Security Law

As a data-intensive institution, commercial banks store a large amount of basic financial data. The implementation of the “Data Security Law” has brought challenges to the data management of commercial banks. Independent but closely related, the roles and responsibilities of the data production department, data user department, data management department, and security management department are difficult to clearly define, personnel security awareness is not balanced, and there are also difficulties in the construction of current data classification and important data catalogs. Ultimately, data security protection and flow control will become more difficult, and data security compliance management costs will be high.

3. Opportunities for commercial banks to implement the Data Security Law

While regulating data activities, the “Data Security Law” insists on paying equal attention to both security and development, and makes corresponding provisions on promoting the openness and utilization of government data, promoting the free flow of transaction data, and ensuring the security of data exiting the country, so that data security can be legally abided by, There are rules to follow, which provides strong support for the safe and healthy development of the digital economy, as well as opportunities for commercial banks. First, the “Data Security Law” advocates the balanced development of data security and value creation, coordinates development and security, insists on promoting data security through data development and utilization and industrial development, encourages and supports the innovative application of data in various industries and fields, and vigorously promotes The security and openness of government data provides a policy basis for commercial banks to deepen “government-bank” data cooperation, promote internal and external data sharing and the orderly flow of data elements, activate the value of data elements, and accelerate digital transformation. Second, the “Data Security Law” advocates and encourages data development and application and research on new technologies, encourages technology promotion and business innovation in the fields of data development and utilization and data security, and promotes data security for commercial banks through artificial intelligence and blockchain technology innovation. Management provides a good guiding effect.

Discussion on the methods of implementing the “Data Security Law” and other regulations

Faced with the above challenges and opportunities, commercial banks should establish a data security closed-loop management system from the levels of organization, system and technology, and promote the effective use of financial data on the basis of comprehensively ensuring data security.

1. Do a good job in the top-level design of commercial bank data security management

First, a commercial bank should establish a leading organization for data security management at the top level. The head office and branches at all levels should set up a leading department for data security management. Each data application department is the main responsible department for the group’s data security management work. Each institution should be responsible for data security management. Under the guidance of the leading organization, the Group closely cooperates and cooperates to carry out the data security management of the group. The second is to establish and improve the data security management system covering the whole range and the whole cycle, and clarify the data security management requirements for each link and the whole scene, such as data collection, storage, transmission, processing, and destruction. The third is to build a data security closed-loop management system and promote the continuous improvement of the data security governance system.

2. Establish and improve the data classification and classification management system and process control mechanism

First, commercial banks should identify and classify existing sensitive business data, establish a unified data classification management system and important data catalog, clarify the elements and principles of data security classification, and adopt different control methods for data with different data security levels. . The second is to establish and improve the data asset security attribute registration mechanism, clarify the responsibilities of the data generation department, data application department, data management department, and system R&D department, and deeply embed data security management and control into the entire process of system requirements, R&D, and application to prevent security loopholes. Implement data security measures in systems, systems, processes and management.

3. Improve data security management capabilities and shared application capabilities

Use emerging technologies such as machine learning, artificial intelligence, and big data analysis to automatically identify and label sensitive data, perform differentiated algorithm encryption for different types of sensitive data, and actively research digitalization including federated learning, multi-party secure computing, and blockchain. technology, promote the improvement of data security management capabilities, and improve the level of data compliance sharing.

4. Strengthen data security talent training and cultural change

One is to increase the cultivation of talents and culture. Continue to carry out full-time and part-time data security management personnel and technical personnel training, and build a data security talent system. Do a good job in the publicity and implementation of data security culture within the group, improve confidentiality awareness, and build a strong data security defense line. The second is to carry out data security inspections and assessments, clarify data security audit tasks, conduct regular inspections of bank data security work, and do a good job in data security problem investigation, so as to find and solve problems as soon as possible. The third is to carry out data security capability model assessment, and comprehensively improve the bank’s data security capability in terms of organization, platform, and system.

Based on the above data security management concepts of commercial banks, the following data security management framework is summarized (see Table 1).

Table 1 Data security management framework of commercial banks

ICBC Data Security Management Practice

In recent years, ICBC has been striving to explore the theory of data security compliance management, vigorously carry out relevant practices, and accumulated some effective practical results.

1. Improve the organizational structure of data security management

According to the “Data Security Law”, “Guidelines” and other legal requirements, ICBC has established a group-wide data security management system with the Fintech Development Committee as the decision-making level, the Head Office’s Management Information Department and the Fintech Department taking the lead, and the headquarters and branches at all levels cooperating with the implementation. Organizational structure, and clarified the work responsibilities of agencies at all levels, and formed a management mechanism with clear powers and responsibilities, and effective cooperation.

2. Improve the data security management system and mechanism

ICBC relies on the construction of a big data service cloud platform to achieve compliance and effective sharing of various types of information, and has issued the “Big Data Service Cloud Data Management Measures”, “Data Sharing Work Rules”, “Big Data Service Cloud Business Emergency Plan” and other systems The method clarifies the data security management requirements for data collection, storage, processing, transmission, and application, and establishes management processes and supporting mechanisms for data integration, authorization, and application.

3. Carry out data classification and asset ownership confirmation

In 2020, ICBC started the construction of the data asset management project, established a data asset catalog, standardized the data asset registration process, and carried out the sorting out of data asset security attributes and departmental authority confirmation. In order to improve the comprehensiveness, effectiveness and accuracy of data security management, ICBC has formulated and released the “Data Security Classification and Classification Specification” in accordance with the “Guidelines for Financial Data Security Classification” of the People’s Bank of China, which clarifies the classification and classification of financial data security across the bank. Objectives, principles, scope, elements and rules, and on this basis, provide references for classification and classification of various financial data, laying a foundation for sorting out data assets and implementing effective data classification and classification management.

4. Strengthen data usage management

In advance, in accordance with the use principle of “necessary for knowledge and minimum authorization”, ICBC has established a cloud data authorization management system for big data services, using a “two-level authorization” method to manage the data authorization of institutions and users, and according to “territorial authorization”. Control the scope of data access based on the principle of During the incident, ICBC took measures such as shielding, desensitization, and encryption to strengthen security management of important information items, and set user access policies by classification and classification to strengthen the protection of key data access. After the incident, ICBC established a systematic user behavior monitoring model, established a data outgoing verification mechanism and a dynamic monitoring mechanism through emails, USB flash drives and other channels to ensure compliance with laws and regulations and data security.

5. Promote the full sharing of group data

In order to promote the circulation of data in the group and standardize the management of information sharing and application within the group, ICBC has established a working mechanism for sharing customer information within the group covering demand submission, application, review, feedback, and effect evaluation. “On the basis of supervision and group consolidated management, it is necessary to promote the sharing and application of information within the group to give full play to the value of data.

At present, although ICBC’s data security management work has made some progress, there is still a long way to go to fully implement the “Data Security Law” and other regulatory requirements, strive to promote the creation of value from data asset elements, and fully realize the development goals of digital transformation. to go.

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LatticeLatticeECP3PCIE Bridging Solution

The LatticeECP3™ (EConomy Plus Third generation) family of FPGA devices is optimized to deliver high perfor-mance features such as an enhanced DSP architecture, high speed SERDES and high speed source synchronous interfaces in an economical FPGA fabric. This combination is achieved through advances in device architecture and the use of 65nm technology making the devices suitable for high-volume, high-speed, low-cost applications. The LatticeECP3 device family expands look-up-table (LUT) capacity to 149K logic elements and supports up to 586 user I/Os. The LatticeECP3 device family also offers up to 320 18×18 multipliers and a wide range of parallel I/O standards. The LatticeECP3 FPGA fabric is optimized with high performance and low cost in mind. The LatticeECP3 devices utilize reconfigurable SRAM logic technology and provide popular building blocks such as LUT-based logic, distrib-uted and embedded memory, Phase Locked Loops (PLLs), Delay Locked Loops (DLLs), pre-engineered source syn chronous I/O support, enhanced sysDSP slices and advanced configuration support, including encryption and dual-boot capabilities. The pre-engineered source synchronous logic implemented in the LatticeECP3 device family supports a broad range of interface standards, including DDR3, XGMII and 7: 1 LVDS. The LatticeECP3 device family also features high speed SERDES with dedicated PCS functions. High jitter toler-ance and low transmit jitter allow the SERDES plus PCS blocks to be configured to support an array of popular data protocols including PCI Express, SMPTE, Ethernet (XAUI, GbE, and SGMII) and CPRI. Transmit Pre-empha-sis and Receive Equalization settings make the SERDES suitable for transmission and reception over various forms of media. The LatticeECP3 devices also provide flexible, reliable and secure configuration options, such as dual-boot capa-bility, bit-stream encryption, and TransFR field upgrade features. The Lattice Diamond™ and ispLEVER® design software allows large compl ex designs to be efficiently imple-mented using the LatticeECP3 FPGA family. Synthesis library support for LatticeECP3 is available for popular logic synthesis tools. Diamond and ispLEVER tools use the synthesis tool output along with the constraints from its floor planning tools to place and route the design in the LatticeECP3 device. The tools extract the timing from the routing and back-annotate it into the design for timing verification. Lattice provides many pre-engineered IP (Intellectual Property) modules for the LatticeECP3 family. By using these configurable soft core IPs As standardized blocks, designers are free to concentrate on the unique aspects of their design, increasing their productivity.

LatticeECP3 device main features:

 Higher Logic Density for Increased System Integration

•17K to 149K LUTs

•116 to 586 I/Os

 Embedded SERDES

•150 Mbps to 3.2 Gbps for Generic 8b10b, 10-bit SERDES, and 8-bit SERDES modes

•Data Rates 230 Mbps to 3.2 Gbps per channel for all other protocols

•Up to 16 channels per device: PCI Express, SONET/SDH, Ethernet (1GbE, SGMII, XAUI), CPRI, SMPTE 3G and Serial RapidIO

 sysDSP™•Fully cascadable slice architecture

• 12 to 160 slices for high performance multiply and accumulate

•Powerful 54-bit ALU operations

• Time Division Multiplexing MAC Sharing

•Rounding and truncation

•Each slice supports

 Flexible Memory Resources

•Up to 6.85Mbits sysMEM™ Embedded Block RAM (EBR)

•36K to 303K bits distributed RAM

 sysCLOCK Analog PLLs and DLLs

•Two DLLs and up to ten PLLs per device

 Pre-Engineered Source Synchronous I/O

•DDR registers in I/O cells

•Dedicated read/write levelling functionality

•Dedicated gearing logic

•Source synchronous standards support

•Dedicated DDR/DDR2/DDR3 memory with DQS support

•Optional Inter-Symbol Interference (ISI)  correction on outputs

 Programmable sysI/O™ Buffer Supports Wide Range of Interfaces

•On-chip termination

•Optional equalization filter on inputs

•LVTTL and LVCMOS 33/25/18/15/12

•SSTL 33/25/18/15 I, II

•HSTL15 I and HSTL18 I, II

•PCI and Differential HSTL, SSTL

•LVDS, Bus-LVDS, LVPECL, RSDS, MLVDS

 Flexible Device Configuration

•Dedicated bank for configuration I/Os

•SPI boot flash interface

•Dual-boot images supported

•Slave SPI

•TransFR™ I/O for simple field updates

•Soft Error Detect embedded macro

 System Level Support

•IEEE 1149.1 and IEEE 1532 compliant

• Reveal Logic Analyzer

• ORCAstra FPGA configuration utility

•On-chip oscillator for initialization & general use

•1.2V core power supply

Figure 1. Simplified Block Diagram of the LatticeECP3-35 Device

EB43 PCI Express Bridge Evaluation Board

As PCI Express applications have emerged, the LatticeECP3™ FPGA family has become a well-suited solution for many system designs. The features of the LatticeECP3 PCI Express Solutions Board can assist engineers with rapid-prototyping and testing their designs. The board is an enhanced form-factor of the PCI Express add-in card specification. It allows for full x1 form-factor compliance and x4 is available for demonstration purposes with some non-standard form-factor issues. The flexibility to use the same board to demonstrate both x1 and x4 configurations is accomplished by simply changing the mounting hardware. The board has several debugging and analyzing fea-tures for complete evaluation of the LatticeECP3 device. This guide is intended to be referenced in conjunction with evaluation design tutorials to demonstrate the LatticeECP3 FPGA.

This user’s guide describes the LatticeECP3 PCI Express Solutions Board featuring the LatticeECP3 LFE3-95EA-FN672 FPGA. The stand-alone evaluation board provides a functional platform for development and rapid prototyp-ing of applications that require high-speed SERDES interfaces to demonstrate PCI Express capabilities using an add-on card form-factor. The board is manufactured using standard FR4 dielectric and through-hole vias. The nom-inal impedance is 50-ohm for single-ended traces and 85-ohm for differential traces.

EB43 PCI Express Bridge Evaluation Board Key Features:

• PCI Express x1 and x4 edge connector interfaces

• Allows demonstration of PCI Express (x 1and x4) interfaces

– x1 is form-factor compliant and will fit a standard PC-equipped PCI Express motherboard socket

– x4 is non-compliant but will demonstrate x4 functionality by a simple change to the hardware

• Allows control of SERDES PCS registers using the Serial Client Interface (ORCAstra) • On-board Boot Flash

– Both Serial SPI Flash and Parallel Flash via MachXO™ programming bridge

• Shows interoperation with a high performance DDR2 memory component

• Includes driver based “run-time” device configuration capability via ORCAstra or PCI Express

• Switches, LEDs, displays for demo purposes

• Input connection for lab-power supply

• Power connections and power sources

• ispVM™ programming support

• On-board and external reference clock sources

Figure 2. EB43 PCI Express Bridge Evaluation Board Outline Drawing

Figure 3. PCI Express Bridging Solution Block Diagram

Figure 4. EB43 PCI Express Bridge Evaluation Board Circuit Diagram (1)

Figure 5. EB43 PCI Express Bridge Evaluation Board Circuit Diagram (2)

Figure 6. EB43 PCI Express Bridge Evaluation Board Circuit Diagram (3)

Figure 7. EB43 PCI Express Bridge Evaluation Board Circuit Diagram (4)

Figure 8. EB43 PCI Express Bridge Evaluation Board Circuit Diagram (5)

Figure 9. EB43 PCI Express Bridge Evaluation Board Circuit Diagram (6)

Figure 10. EB43 PCI Express Bridge Evaluation Board Circuit Diagram (7)

Figure 11. EB43 PCI Express Bridge Evaluation Board Circuit Diagram(8)

Figure 12. EB43 PCI Express Bridge Evaluation Board Circuit Diagram(9)

EB43 PCI Express Bridge Evaluation Board Bill of Materials (BOM):

Figure 13. EB43 PCI Express Bridge Evaluation Board Component Layout (Top Layer)

Figure 14. EB43 PCI Express Bridge Evaluation Board Component Layout (Bottom Layer)

For details, see:

http://www.latticesemi.com/documents/ds1021ea.pdf

and

http://www.latticesemi.com/documents/EB43.pdf

The Links:   BSM50GD120DN2 G101EVN01.3

What role does 650W power supply play in PC power supply?

Industry experts often say that the current 650W power supply is the “golden oil” today. With the development of hardware technology, the energy consumption ratio of computer hardware has been steadily increasing. In other words, under the same performance, the new technology makes the hardware Power consumption becomes lower. But this does not mean that the power consumption of the computer is also decreasing, because this sentence can also be understood as, in the case of the same power consumption, the new process makes the performance of the hardware higher. For hardware manufacturers, it is obvious that the second understanding is more conducive to the subsequent development of products. After all, for most consumers, the temptation brought by high performance is more significant than low power consumption.therefore

Industry experts often say that the current 650W power supply is the “golden oil” today. With the development of hardware technology, the energy consumption ratio of computer hardware has been steadily increasing. In other words, under the same performance, the new technology makes the hardware Power consumption becomes lower. But this does not mean that the power consumption of the computer is also decreasing, because this sentence can also be understood as, in the case of the same power consumption, the new process makes the performance of the hardware higher. For hardware manufacturers, it is obvious that the second understanding is more conducive to the subsequent development of products. After all, for most consumers, the temptation brought by high performance is more significant than low power consumption. Therefore, it is also the mainstream configuration. Now the power consumption of computer hardware has not become lower, but may even be higher, but the performance improvement is greater.

A power supply with a rated power of 500W is no longer a “one-size-fits-all” choice today

It is precisely because of this that the mainstream power of PC power supply is actually gradually increasing with the times. Once upon a time, a power supply of about 300W can meet the needs of most platforms, but as more and more graphics cards require external power supply, 500W in recent years. The power supply on the left and right has become the “one-size-fits-all” choice, which can meet the power supply needs of mainstream platforms at a reasonable price, and has the ability to support high-end platforms. Since these two years, the 500W power supply can only be regarded as an entry-level product. Although the mainstream platform is not a big problem, it is really difficult to support the use demand of high-end platforms. Obviously, it can no longer be used as a “one-size-fits-all” power supply. It is a power supply product with a rated power of not less than 600W or even 650W.

We are not making this point without foundation. First of all, about the increasing power consumption of mainstream platforms, various evaluation data have been hammered. Even Intel itself has indeed released the corresponding power supply design specification requirements, indicating that its own In fact, the power supply requirements of processor products have been greatly improved. According to the relevant information released by Intel, the same TDP 95W product, the +12V CPU power supply corresponding to the 6th/7th generation Core processor only needs a continuous 16A and peak 18A power supply, but the 8th/9th generation Core processor will be corresponding The requirements have been raised to a continuous 22A and a peak value of 29A. Even the 8th/9th generation processors with TDP 65W have higher power supply requirements than the 6th/7th generation Core processors with TDP 95W.

When it comes to the 10th generation Core processor, the demand for +12V CPU power supply is higher, because the 10th generation Core processor no longer has the TDP 95W grade, but directly replaces it with TDP 125W, and the demand is continuous. 26A, peak current of 34A; and the 10th generation Core processor with TDP 65W also has higher power supply requirements than the 8th/9th generation, which requires continuous 23A and peak value of 30A, which is already higher than the latter’s TDP 95W product. Slightly higher. Therefore, we might as well convert it to the power supply requirements of the 10th generation Core processor, which means that its TDP 65W processor requires at least a continuous 12V*95%*23A≈263W and a peak value of 12V*95%* on the +12V power supply. 30A=342W power (multiplied by 95% because the voltage allows ±5% deviation, and the calculation is calculated according to -5%), TDP 125W processor needs power supply +12V power supply, at least continuous 12V*95%* 26A≈297W, peak power of 12V*95%*34A≈388W.

Of course, the power supply +12V power supply is not only for the CPU, but the graphics card is also a very important +12V power supply object, and the requirements are not inferior to the CPU. Here we briefly list the actual power consumption of several graphics cards (subject to the FE version or the public version). The FE version of the mainstream RTX 2060/2070/2080/2080 Ti (that is, the public version) has a full load power consumption of 160W. /190W/230W/260W, the full-load power consumption of the RX 5700/5700 XT graphics card is about 170W/220W, in other words, for mainstream platforms, you need to set aside a power margin of not less than 200W for the graphics card to use. For high-end and flagship platforms, you need to set aside no less than 300W of power consumption for the graphics card.

Therefore, according to this calculation, for the 10th generation processor, you should at least prepare a power supply with +12V output power not less than 263W+200W=463W, recommended 388W+300W=688W, plus other peripheral hardware at + The consumption of 12V, +5V, +3.3V power supply, 500W starting, 700W regular should be regarded as the standard match of the tenth generation Core processor platform. This also confirms what we said before, the 500W power supply can no longer meet the positioning of “high and low pass kill”, and at least a product with a rated power of 600W can be regarded as the current “magic oil” power supply.

In addition, we have also proposed a PL estimation method to select a power supply before. Taking a platform with a Core i9-9900K processor and a GeForce RTX 2080 Ti graphics card as an example, according to the PL estimation method, the full load power consumption of this platform should be numerically the same as 210W+ 325W=535W is similar, so a power supply with a rated power of not less than 600W is also required. Of course, we prefer to choose according to the minimum 535W/0.8=668.75W≈700W, and the recommended 535W/0.5=1070W≈1100W, which can better avoid restarts, crashes, black screens, blue screens, etc. caused by excessive instantaneous power. Weird question.

To sum up, the power supply with a rated power of 600W to 650W is currently regarded as a “high-low pass-kill” product. It can not only easily meet the needs of mainstream platforms, but also has the potential to upgrade to high-end platforms or even flagship platforms. The emphasis is on “budget sensitivity” or “performance priority”, and there are plenty of corresponding products on the market to choose from. Now the three words “magic oil” can be regarded as worthy of their name when placed on such a power supply product.

There are not a few motherboards that use 4pin+8pin for CPU power supply. Therefore, when purchasing a power supply, it is necessary to pay attention to whether the number of CPU power supply interfaces matches.

So what kind of 600W/650W power supply products are worthy of players to choose? In fact, the choice of power supply depends on four aspects: performance, expansion capability, price and warranty. Among them, the performance can use our super power index or the upcoming The online power ladder list is used as a standard; the expansion capability is measured according to your own needs, but according to the current motherboard power supply interface configuration, the CPU power supply interface can provide two 4+4 pin power supply products should be given priority; as for The price and warranty time are public information, which can be easily checked by everyone.

Of course, you can also directly refer to our “2018 Juxian (4): 11 650W Full-Module 80Plus Gold + Power Supply Hengping” for selection. Although the time since the article was published is now more than one year, the power supply products The development cycle is usually 5 years, so the products mentioned in this article are basically still on sale. For players who pay attention to “performance first”, products with a super performance index above 85 in the Hengping evaluation are worth considering, such as Antec HCG 650 Gold, Haiyun Focus+ 650 Gold, Zhenhua Leadex Gold 650, EVGA Supernova 650 G+ , Corsair RMx 650, etc., are all products with very good performance.

Xianma Gold Medal 650W Power Supply

For “budget-sensitive” players, there are also very good cost-effective 600W/650W power supplies on the market, such as Xianma gold 650W power supply, 80Plus gold certification, full-Module wire design, super power index can reach 80 points , the performance is in the middle of the 650W power supply, and the price is only 479 yuan. If it is the fan price or promotional price on JD.com, it can even start at 449 yuan/439 yuan. And recently, they have also upgraded the wires of the power supply. The 4+4pin power supply interface of the CPU has been upgraded from 1 to 2, so that the power supply can meet the needs of more platforms and further improve its scope of application. The cost performance can be said to be quite high.

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Next-generation low-power, high-performance TI Jacinto 7 processors enable mass market adoption of automotive ADAS and gateway technologies

Beijing, January 8, 2020 – Texas Instruments (TI) (NASDAQ: TXN) today introduced the new Jacinto 7 processor platform. Based on TI’s decades of automotive systems and functional safety knowledge, the new Jacinto processor platform features enhanced deep learning capabilities and advanced network processing to address design challenges in advanced driver assistance systems (ADAS) and automotive gateway applications.

The first two automotive-grade chips in the platform family, the TDA4VM processor for ADAS and the DRA829V processor for gateway systems, contain specialized accelerators for accelerating data-intensive tasks such as computer vision and deep learning. In addition, the TDA4VM and DRA829V processors contain functional safety-enabled microcontrollers (MCUs), enabling automotive manufacturers (OEMs) and Tier 1 suppliers to simultaneously support ASIL-D safety-critical tasks and functions with a single chip. The two chips share a software platform that enables developers to reuse large software investments across applications in multiple vehicle domains, reducing system complexity and development costs. For more information on the Jacinto 7 processor, see www.ti.com/Jacinto7-pr.

Improve vehicle perception with lower power consumption

By tapping into camera, radar and lidar data, ADAS technology helps cars see and adapt to the world around them. The influx of information into the car means that the processor or system-on-chip needs to manage multiple levels of data processing in real time quickly and efficiently, and needs to meet the power consumption requirements of the system. TI’s new processors use only 5 to 20W of power to perform high-performance ADAS operations without active cooling.

The TDA4VM processor has powerful on-chip data analysis capabilities combined with vision preprocessing accelerators to make system performance more efficient. Automakers and Tier 1 suppliers can use it to develop front-facing camera applications that use a high-resolution 8-megapixel camera to help vehicles see farther and incorporate more driver-assistance enhancements. In addition, the TDA4VM processor can operate 4 to 6 3-megapixel cameras simultaneously, and can also combine radar, lidar and ultrasonic and other various perception processing on a single chip. This multi-level processing capability enables TDA4VM to be competent as the centralized processing unit of ADAS, thereby realizing key functions in automatic parking applications (such as surround view and image rendering Display), while enhancing vehicle perception capabilities to achieve 360-degree recognition perception.

Accelerating the Data Highway for Software-Defined Vehicles

The DRA829V processor seamlessly integrates the computing power required by modern automotive gateway systems. As automotive technology advances, automotive gateways require a flexible processor to manage larger data volumes while being able to support the escalating requirements for autonomous driving and communication connectivity. The DRA829V processor is the first processor in the industry to integrate an on-chip PCIe switch. At the same time, it also integrates an 8-port Gigabit Ethernet switch that supports TSN, enabling faster high-performance computing and vehicle-to-vehicle communication.

Combined with the ability to support ASIL-D high safety and non-safety-related task processing, these computing and communication capabilities enable automotive manufacturers and Tier 1 suppliers to implement a variety of applications with different requirements on a single chip. Higher on-chip bandwidth also helps developers better manage in-vehicle software development and validation, which means more flexible updates and upgrades.

Availability

Developers can start designing immediately using the Jacinto 7 processor development kit and purchase the new TDA4VMXEVM and DRA829VXEVM evaluation modules on TI.com. Pre-production TDA4VM and DRA8329V processors are available now from TI, with volume production expected in the second half of 2020.

Design support for other next-generation Jacinto processors

· Read the white paper on automotive gateways and automated parking.

· Watch our technical training and overview of the Jacinto 7 processor.

The Links:   G065VN01 V0 NL8060BC31-42