2020 is destined to be an extraordinary year. The sudden outbreak of the new crown epidemic disrupted our normal study, life and work, and also caused a huge impact on the global economy. At the same time, “new infrastructure” has been frequently screened this year and has become a “hot word” in China’s economy.
On April 20, the National Development and Reform Commission for the first time clarified the scope of new infrastructure, including information infrastructure, integration infrastructure, and innovation infrastructure. On May 22, the “new infrastructure” was officially written into the government work report. The “Report” proposes: “Strengthen the construction of new infrastructure, develop a new generation of information networks, expand 5G applications, build charging piles, promote new energy vehicles, stimulate new consumer demand, and help industrial upgrading.” “Infrastructure” mainly includes seven major areas: 5G infrastructure, UHV, intercity high-speed railway and urban rail transit, new energy vehicle charging piles, big data centers, artificial intelligence, and industrial Internet.
Recently, “Application of Electronic Technology” invited a number of semiconductor manufacturers with a wide range of representatives to review 2020 and look forward to 2021 on the topic of “new infrastructure”!
Ms. Su Linlin, Vice President of Ziguang Guowei
Question 1: In 2020, what major impacts will my country’s “new infrastructure” strategy have on the semiconductor industry?
Su Linlin:“New infrastructure” refers to the construction of new infrastructure based on 5G, UHV, rail transit, new energy vehicle charging piles, big data centers, artificial intelligence, industrial Internet, etc. The extensive application and empowerment of new generation information technology is ” The important characteristics of “new infrastructure”, the impact on the semiconductor industry mainly includes two aspects:
First, the semiconductor industry has brought a lot of new demand.Such as communication chips in 5G applications, power chips in UHV/rail transit/new energy vehicle charging pile applications, computing and storage chips in big data centers/artificial intelligence applications, security chips in industrial Internet applications, etc., to further consolidate China’s position in the global semiconductor market.
The second is to drive the development of the domestic chip industry.The “new infrastructure” superimposed on the domestic supply chain demand under the background of the trade war will drive the technological innovation and large-scale application of the domestic chip industry, and further form a good ecology of application-driven industrial development.
Question 2: How does your company view “new infrastructure”? What are the specific strategies and measures for the development of the company’s business in the field of “new infrastructure”?
Su Linlin:“New infrastructure” is a major development opportunity for the company.In order to design chip products that are more in line with the needs of innovative application scenarios such as “new infrastructure”, Tsinghua Unimicron is based on the core capabilities of smart chips, deeply cultivated in fields such as smart industry, smart finance, smart city, and smart life, and has carried out extensive cooperation with downstream enterprises in the industry chain. , continue to enrich product categories, empower thousands of industries, and build their own chip industry ecology.
Question 3: What are the analysis and predictions on the impact of “new infrastructure” on the semiconductor industry in 2021?
Su Linlin:The just-concluded Central Economic Work Conference clearly stated that in 2021, it is necessary to adhere to the strategic basis of expanding domestic demand and increase investment in new infrastructure; at the same time, it is necessary to enhance the independent and advanced capabilities of the industrial chain and supply chain, and implement key core technologies for weak links in the industry. project to solve a batch of “stuck neck” problems as soon as possible. foreseeable:On the demand side, the domestic semiconductor industry will continue to benefit from the huge demand brought about by “new infrastructure”, and the market space is expected to be further improved; on the supply side, policy support and industrial chain cooperation are expected to be further improved to carry out technological breakthroughs for domestic enterprises. Independent innovation, to ensure the supply of the industrial chain and create favorable conditions.
Question 4: For the specific fields involved in “new infrastructure” (5G, industrial Internet, artificial intelligence, data centers, new energy charging piles, rail transit, UHV), please answer from the following three aspects:
(1) What opportunities and challenges does the development of this field bring to the semiconductor industry?
(2) What products, solutions and services does your company have in this field?
(3) What new semiconductor technologies and products are expected to develop in this field in 2021?
Su Linlin took the 5G field as an example to answer:
(1)The 5G era started with the construction of large-scale base stations, which will drive huge demand for radio frequency chips, baseband chips and power management chips.In terms of radio frequency chips, the increase in 5G frequency rate will drive the popularization of GaN power amplifier applications; in terms of baseband chips, the performance will be further improved, and the process will move towards the 5nm node; in terms of power management chips, 5G base stations will be more dense than 4G, with higher power and higher power consumption. more power supply needs to come.
At the same time, as an important fundamental and enabling technology, 5G has greater significance for the semiconductor industry:5G will promote the technological progress and explosive growth of many related industries such as consumer electronics, the Internet of Things, the Internet of Vehicles, and the industrial Internet, thereby creating more semiconductor application scenarios and market demand.
(2) In response to the demand for high-security, high-reliability, and large-capacity storage in the 5G era, Tsinghua Unigroup has created a 5G super SIM card product, which combines the highest-level domestic security chip and large-capacity storage into one. The maximum storage capacity of the SIM card is only 512KB, and the storage capacity of the super SIM card can reach hundreds of GB, thus providing unlimited possibilities for personal and industrial applications in the 5G era:
For consumer users, the 5G super SIM card has the four characteristics of secure storage, large capacity, one-click replacement, and money saving and convenience, and can become the user’s private data center. For industrial users such as the industrial Internet, 5G super SIM card = enabling platform + data warehouse, realizing the identification of industry terminals, the secure transmission of data between the terminal and the platform, and the local secure storage of data.At present, Ziguang Guowei has launched a number of industry solutions such as super SIM card + smart government affairs, super SIM card + industrial Internet, super SIM card + quantum communication, super SIM card + Internet of Vehicles, etc., to help 5G empower thousands of industries.
(3)In 2021, 5G will usher in a year of accelerated adoption, the penetration rate of consumer terminals such as 5G mobile phones has continued to increase, and industry, transportation, medical and other industries have further formed a benchmark application model that can be replicated and promoted, and industry applications have accelerated.therefore5G mobile phone-related RF chips, power management chips, sensors and other related products are expected to take the lead in achieving greater development opportunitiesOpportunities in other fields include high-performance computing driven by the development of cloud computing and big data, demand for storage devices, industrial Internet security requirements, and automotive electronic chip requirements.
The Links: PM150CL1A120 SK35GD12T4